Polymaker Polymide CoPA Low-Warp Nylon Filament
PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
PolyMide™ CoPA features Polymaker's Warp-Free™ technology:
- Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 80˚C for 6h
NOTE: When used extensively, PolyMide™ CoPA can be abrasive to brass nozzles. When using PolyMide™ CoPA, we recommend to switch to a wear resistant nozzle such as hardened steel, Vanadium, or Nozzle X.
- Nozzle Temp: 250˚C – 270˚C
- Bed Temp: 25˚C – 50˚C
- Print Speed: 30mm/s – 60mm/s
- Bed Surface: Glass with PVA (glue stick)
- Part Cooling Fan: Off