Bambu Support for PLA
Description
Description
Bambu Support for PLA (New Version)
Bambu Support for PLA is fully compatible with all Bambu Lab PLA filaments and Bambu Lab printers, offering effortless peel-off removal, smooth interface quality, with reliable performance. It eliminates the need for post-processing, saving time while delivering flawless results. All at a budget-friendly price. Upgrade your 3D printing experience today!
Product Features
- Effortless Removal
- Preserve Every Detail
- Affordable Choice
- Use for Support Interface
- Comes with Basic Reusable Spool
- Diameter: 1.75 mm +/- 0.05mm
Cautions for Use
- Only Used for Printing the Support Interface
- Avoid Printing Individual Models
- AMS & AMS lite Compatible
Effortless Removal
Bambu Support for PLA is specifically designed for PLA filaments, ensuring clean, residue-free removal by hand. Say goodbye to post-processing and enjoy a seamless 3D printing experience.
Preserve Every Detail
With optimized support interface settings* in Bambu Studio, Bambu Support for PLA delivers an ultra-smooth contact surface that protects intricate details as if untouched. Perfect for delicate designs, overhangs, and bridges, it ensures premium quality from start to finish.
* 0mm top interface spacing and 0mm Z-distance settings
Affordable Support, Premium Performance
Bambu Support for PLA delivers enhanced performance at 34% less cost than its predecessor. Enjoy greater stability, improved printability, and better results, all while saving money.
Use for Support Interface
Activate the "Support/raft interface" setting in Bambu Studio to apply support material exclusively to contact surfaces. This approach minimizes material usage, saving both time and money.
Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate |
Cool Plate SuperTack, Smooth PEI Plate, Textured PEI Plate
|
/ |
| Hotend | All Size / Material | / |
| Bambu Liquid Glue / Glue Stick | Bambu Liquid Glue / Glue Stick | / |
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C, 8 h |
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 220 - 230 °C |
| Bed Temperature (with Glue) | 35 - 45 °C |
| Printing Speed | < 200 mm/s |
| Physical Properties | |
| Density | 1.33 g/cm³ |
| Vicat Softening Temperature | N / A |
| Heat Deflection Temperature | N / A |
| Melting Temperature | 190 °C |
| Melt Index | 13.6 ± 1.2 g/10 min |
